Last night Intel CEO Pat Gelsinger and Ann Kelleher, Intel’s GM of technology development, led a webcast to highlight new developments at the company.
Here are 5 top takeaways:
1. The new Intel Foundry Service already has 100 customers in the pipeline, and it has just signed big deals with AWS and Qualcomm.
2. Intel has “crossed over” with its 10nm SuperFin architecture, meaning the company is now making more 10nm chips than it is older 14nm chips.
3. Intel is renaming its next generations of microprocessor chips. Gelsinger said the old node naming and numbering “didn’t tell the full story.” Here are the new names and the expected timings:
> Intel 7: Delivers a 10% to 15% performance boost over 10nm SuperFin. Will power the forthcoming Alder Lake for PCs, which ships later this year, and Sapphire Rapids for the data center, which will ship in Q1 of 2022.
> Intel 4: This goes into production in the second half of 2022 for shipments in 2023. Will appear as Meteor Lake (PC) and Granite Rapids (data center). Delivers an estimated 20% performance gain over Intel 7. To manufacture this chip, Intel will start using Extreme Ultraviolet (EUV) lithography.
> Intel 3: Delivers an 18% performance boost over Intel 4. Will be manufacturing in the second half of 2023.
> Intel 20A: As Intel approaches 1nm, the naming changes to “A” for angstrom (1/10 of a nanometer). So this one will have a gate that’s 20A long. Ann Kelleher called this the “start of the angstrom era.” This chip is set for introduction in the first half of 2024. Also, it will use 2 new Intel packaging technologies, RibbonFET and PowerVia.
> Intel 18A: Targeted for 2025 and said to be in the works already.
4. Intel will announce major investments in fab plants later this year, both in the U.S. and Europe. These will be on top of the $20 billion the company already said it would invest in Arizona and $3.5 billion in New Mexico.
5. Intel is now the only major chip maker doing all its R&D and manufacturing in the USA, said Gelsinger — “from lab to fab.”